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Opinion: Congress needs to support Connecticut high technology companies
Hartford Courant· 5 days agoThe CHIPS Act passed last year because legislators on both sides of the aisle worked together when...
TSMC struggles to meet demand for CoWoS packaging, holding back AI and HPC chip production: report
Tom s Hardware· 5 days agoThis surge in investment is driving up demand for AI processors and putting pressure on production...
The role of elasticity on adhesion and clustering of neurons on soft surfaces - Communications...
Nature· 3 days agofMCI experiments on soft PDMS surfaces and mathematical models suggest that – in the low MPa range – increasing material compliance boosts neuron adhesion, clustering, and communication, impacting tissue engineering and regenerative medicine.
High Five: 5 Cultivation Styles
High Times· 5 days agoUsing aeroponics, cannabis roots are suspended in the air and are fed water and nutrients via a fine mist. Aeroponics doesn’t require any type of medium or substrate, and ...
Semiconductor advancement could lead to low-cost, flexible electronic devices
Tech Xplore· 3 days agoAn innovation, described in a study published May 2 in Scientific Reports, could help change that....
Semiconductor advance could lead to improved electronic devices
UB Reporter· 2 days agoThe public’s appetite for inexpensive and powerful electronic devices continues to grow. While silicon-based semiconductors have been key to satiating this demand, a superior alternative could ...
Tensor G5 development at TSMC for Pixel 10 progressing
9to5Google· 11 hours agoIn July of 2023, Google’s switch from Samsung to TSMC for the Tensor G5 was definitively reported,...
Predictive modeling of molds effective elimination by external inactivation sources - Scientific...
Nature· 6 days agoPresented paper deals with a novel application of the (nonlinear) logistic equation to model an elimination of microscopic filaments types of fungi-molds from affected materials via different ...
Can Nvidia Stock Reach The Summit With Its Fiscal Q1 Report?
Investor's Business Daily· 5 days agoCoWoS, which stands for Chip-on-Wafer-on-Substrate, is an advanced packaging technology. Worries Of...
What will we eat on the Moon? The food is literally out of this world
BBC News· 17 hours agoPasta and protein bars made out of thin air are just the beginning. In the next two years, Nasa...