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Samsung and SK hynix to use new 1c DRAM on next-gen HBM4 memory for future-gen AI GPUs
TweakTown· 2 days agoThe development of the next-gen HBM4 memory standard is happening: Samsung, SK hynix, and TSMC...
TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry
AnandTech· 4 days agoAlthough TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes...
The world's largest chipmaker could flip a kill switch and remotely disable its machines in the...
PC Gamer· 4 hours agoTSMC is the world's largest chipmaker, and it produces a massive percentage of the world's advanced...
Apple reportedly seeking first batch of 2nm chips from TSMC
Android Headlines· 21 hours agoApple would be looking to secure the first batch of chip manufacturing in TSMC’s 2nm process. The...
Samsung, Stung by AI Missteps, Ousts Its Top Semiconductor Executive
The Wall Street Journal· 17 hours agoThe South Korean tech company has tapped a turnaround specialist, hoping to grab more business with...
TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodes
Tom's Hardware via Yahoo News· 5 days agoWe collaborate with EDA partners like Cadence, Synopsys, and Ansys to certify HBM4 channel signal...
TSMC might not use ASML's latest High-NA EUV machines for its future-gen A16 process in 2026
TweakTown· 7 days agoTSMC's future-generation A16 process might not use ASML's latest High-NA EUV lithography machines,...
Samsung All Set To Commence Mass Production Of Its 3nm Exynos Chipset In The Second Half Of 2024,...
Wccftech· 2 days agoA new Exynos chipset is said to enter mass production in the second half of 2024, as Samsung is expected to aggressively increase the adoption of its in-house silicon for ...
European research labs to receive US$2.72 billion funding from EU’s Chips Act
South China Morning Post· 13 hours agoThe EU research and development line is intended to help develop future generations of even more...
TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodes
Tom s Hardware· 5 days agoAt the European Technology Symposium 2024 this week, TSMC said that it would build HBM4 base dies using its 12FFC+ (12nm-class) and N5 (5nm-class) process technologies...HBM4 ...